EOS presents new periphery module for material handling

October 9, 2017 6:04 pm

EOS, global technology supplier in the field of industrial 3D printing of metals and polymers, introduces the material handling solution IPCM M pro for its EOS M 290 system. For this purpose, the EOS M 290 – a highly productive system for the Additive Manufacturing (AM) of metal components–is equipped with a special process chamber door with coupling points to connect with the IPCM M pro and material containers. The combination of system and periphery enables users to convey material easy, fast and safe out of the system, sieve it and refill it into the system – thus, simplifying industrial 3D printing as an established manufacturing method overall.

In AM, a laser beam fuses powdered material at points defined by computer-generated component design data. With the IPCM M pro, material not fused during the building process can be directly conveyed out of the AM system – without opening the process chamber door and therefore without the operator coming into direct contact with the material. “A vacuum pump conveys the powder out of the system and into the IPCM M pro, where it is sieved under inert gas within the module at a throughput of 120 kilograms of material in 30 minutes – 50 per cent faster than previous solutions,” EOS claims. Powder treated in this way can be used for a new building process, the powder cycle starts anew.

For the user, this semi-automated, dust-free material handling within the process chamber of the AM system has clear advantages in terms of health and safety as well as operability, as the risk of powder contact is minimised. This makes a more comfortable protective equipment possible for the operator without compromising safety in any way. At the same time, even large volumes of material can be sieved and conveyed more quickly and the manual tasks are both fewer and simpler. Moreover, the IPCM M pro module is mobile, which means it can be efficiently used for several systems. All of these points contribute towards additionally improving user-friendliness and productivity of AM.

For more information, visit www.eos.info